Hydrogenated Terpene Phenolic Resin
Foreverest Hydrogenated Terpene Phenolic Resin is a hydrogenated grade of terpene phenolic resin, it copolymerized by combining the renewable terpene resin and phenol with the enhanced properties of excellent thermal stability and UV stability in addition to the original properties of terpene phenolic resin.
This resin meets the demands for products that require superior transparency and stability.
Substance Identification
| Synonyms | Hydrogenated Terpene Resin |
| CAS | 1254557-84-0 |
| EINECS | N/A |
| FEMA | N/A |
| HS.CODE | N/A |
| Molecular Formula | N/A |
| Moleclar Weight | N/A |
Application & Uses
Tyre & Rubber Compounding
- Tyre tread compounds: hydrogenated terpene-phenolic resins not only improve tread wear resistance and wet-skid resistance, but also reduce rolling resistance by optimising interactions between rubber molecular chains, thereby enhancing fuel efficiency.
- Compatibility & reinforcement: excellent compatibility with natural rubber and synthetic rubbers (e.g. SBR, BR) ensures uniform dispersion during mixing and the formation of a stable network structure, improving tensile strength and tear strength of the composite.
Hot-Melt & Pressure-Sensitive Adhesives
- Water-white HMAs and PSAs: the water-white colour of hydrogenated terpene-phenolic resins enables their use in light-coloured or transparent adhesive formulations whilst retaining the high cohesive strength and heat resistance characteristic of phenolic resins.
- EVA-based HMAs: markedly adjusts the viscosity–temperature profile, improves substrate wetting, and increases the shear strength of bonded joints.
Electronic Encapsulation
- High-frequency device encapsulation: the reduced double-bond content of hydrogenated terpene-phenolic resins limits side reactions during high-temperature curing, lowering dielectric loss and making them well suited for encapsulation of high-frequency, high-speed electronic devices.
- Epoxy system synergy: potential as a curing agent or toughening agent, offering synergistic effects with epoxy systems.
- Advanced composite encapsulants: owing to their regular molecular structure and high purity, hydrogenated terpene-phenolic resins show promise as a superior matrix or interfacial modifier for advanced electronic encapsulation composites with high thermal conductivity and low dielectric constant. When combined with nano-fillers such as boron nitride or graphene, they have been demonstrated to significantly enhance the thermal conductivity and electromagnetic-wave absorption performance of the resulting composites.
Features & Benefits
- Improved UV and improved heat resistance
- Colorless, transparent, and odorless
Sales Specification
| ITEM | VALUE |
|---|---|
| Appearance | White, transpearant, solid like ice |
| Color, @Hasen, # | 100 max |
| Softening Point, @DEG, ℃ | 110 to 120 |
| Bromine Value, Br g/100g | 5 to 10 |
| Acid Value, mg KOH/g | 0.5 max |
Similar Specs
GHS Hazard Statements
| No GHS data available |
Storage
- flammable materials should be stored in a separate safety storage cabinet or room
- ground all equipment containing material
- keep away from heat
- keep away from sources of ignition
- keep container tightly closed
- keep in a cool, well-ventilated place
Relation Products
Relation Articles
- [Internal Sharing Session Memo] Differences between Terpene Resins Synthesised from Different Pinene Monomers, Their Applications, and a Discussion on Resin Supply Chain Stability
- The Characteristics of Hydrogenated Terpene Phenolic Resin.
- Food Industry Application of Terpene Resin
- How to choose tackifier resins for Non-woven adhesives
- Recent advances in bio-based epoxy resins and bio-based epoxy curing agents
- Reshaping Adhesive and Sealant Formulation Strategies
- TACKIFIERS: MARKET EVOLVES WITH DEMAND FOR ADHESIVES SEALANTS AND LABELS
- Choosing the Correct Soldering Flux Types and Their Advantages/Disadvantages
Remark
The above information is believed to be accurate and represents the best explanation currently available to us. However, no liability is assumed for any consequences arising from the use of this content. The technical standards for our products are developed and updated jointly by our customers and ourselves; where any changes occur, the latest specification shall prevail and will be confirmed in the relevant contract.All suggestions and data provided are based on information we consider to be reliable and are offered in good faith, but without any guarantee, as the conditions and methods of use of our products are beyond our control. Foreverest® makes no warranties, whether express or implied, regarding the accuracy, completeness or suitability of this information, and expressly disclaims any implied warranty of fitness for a particular purpose. Prospective users should conduct their own tests and evaluations to determine the suitability of Foreverest® materials and any recommendations for their intended applications before adoption, and, where appropriate, should obtain confirmation or approval from the relevant regulatory authorities.Any references in this page to patents or patented technologies, including descriptive material derived from patents or citations of specific patent numbers, are provided for information only. They must not be interpreted as a recommendation to use our products in a manner that could infringe any third‑party patent, nor as a grant of any licence or permission to use patents owned by Foreverest®.
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