Chemicals A-Z
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Soldering Flux & Plating
In soldering, soldering flux is a product that is applied to improve the solder joint's quality by promoting wetting and bonding between the solder and the surfaces being joined. Its primary function is to remove or prevent the formation of oxides on the metal surfaces being soldered, allowing the solder to flow more easily and create a strong, durable connection.
Purposes in the soldering process
- Oxide Removal
- Wetting
- Preventing Oxidation
- Improving Heat Transfer
Liquid soldering flux for electronics is capable of removing oxidizing materials from the surface of a PCB. Gum Rosin, Modified Rosins Resins are the key raw materials have 1~45 %Wt. in the formulation of Rosin Fluxes, and have 2~8 %Wt. in the Low Solids/No-Clean Fluxes. The activities of rosin acid remove oxides and extend tin material on the PCB surface. Forming a coating on the solder joints also prevents re-oxidation.
Click to learn our Rosin Derivatives Solution for Soldering Flux.
Water-White Hydrogenated Rosin
CAS: 65997-06-0
SPECS: H301, H101
Water-White Hydrogenated Rosin is one of the dominant varieties of modified rosin with a light color, high oxidation resistance and high thermal stability.It is soluble in ketones, esters, hydrocarbon…